A method for manufacturing a semiconductor package includes disposing a structural body over one surface of a substrate formed with a plurality of bond fingers and a plurality of dummy bond fingers; forming an overhang portion by stacking a semiconductor chip formed with a plurality of bonding pads and a plurality of dummy bonding pads adjacent to one edge over the structural body such that the one edge projects out of a side surface of the structural body; forming a plurality of dummy wires which electrically couple the dummy bonding pads and the dummy bond fingers; and forming a plurality of conductive wires which electrically couple the bonding pads and the bond fingers after the dummy wires are formed.