Invention Grant
US09305924B2 Semiconductor device having gate electrode embedded in gate trench
有权
具有嵌入栅极沟槽中的栅电极的半导体器件
- Patent Title: Semiconductor device having gate electrode embedded in gate trench
- Patent Title (中): 具有嵌入栅极沟槽中的栅电极的半导体器件
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Application No.: US13934935Application Date: 2013-07-03
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Publication No.: US09305924B2Publication Date: 2016-04-05
- Inventor: Noriaki Mikasa
- Applicant: PS4 LUXCO S.A.R.L.
- Applicant Address: LU Luxembourg
- Assignee: PS4 Luxco S.a.r.l.
- Current Assignee: PS4 Luxco S.a.r.l.
- Current Assignee Address: LU Luxembourg
- Priority: JP2012-156452 20120712
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L27/108 ; H01L27/02

Abstract:
Disclosed herein is a device that includes: a substrate having a gate trench; a gate electrode embedded in the gate trench with an intervention of a gate insulation film; and an embedded insulation film embedded in the gate trench. The substrate includes a first impurity diffusion region in contact with the embedded insulation film and a second impurity diffusion region in contact with the gate insulation film. The gate trench including a first trench portion extending in a first direction and second and third trench portions branching from the first trench portion and extending in a second direction that crosses the first direction. The gate electrode including first, second and third electrode portions embedded in the first, second and third trench portions of the gate trench, respectively. The first impurity diffusion region being sandwiched between the second and third electrode portions.
Public/Granted literature
- US20140015027A1 SEMICONDUCTOR DEVICE HAVING GATE ELECTRODE EMBEDDED IN GATE TRENCH Public/Granted day:2014-01-16
Information query
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