Invention Grant
- Patent Title: Optoelectronic devices with back contact
- Patent Title (中): 具有背面接触的光电器件
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Application No.: US14749067Application Date: 2015-06-24
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Publication No.: US09305964B1Publication Date: 2016-04-05
- Inventor: Effendi Leobandung , Ning Li , Tak H. Ning , Jean-Olivier Plouchart , Devendra K. Sadana
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Louis J. Percello, Esq.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L27/146
Abstract:
A semiconductor structure includes an optoelectronic device located in one region of a substrate. A dielectric material is located adjacent and atop the optoelectronic device. A top contact is located within a region of the dielectric material and contacting a topmost surface of the optoelectronic device. A bottom metal contact is located beneath the optoelectronic device and lining a pair of openings located with other regions of the dielectric material, wherein a portion of the bottom metal contact contacts an entire bottommost surface of the optoelectronic device.
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