Invention Grant
- Patent Title: Trench shielding structure for semiconductor device and method
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Application No.: US14216914Application Date: 2014-03-17
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Publication No.: US09306018B2Publication Date: 2016-04-05
- Inventor: Peter A. Burke , Gordon M. Grivna , Prasad Venkatraman
- Applicant: Semiconductor Components Industries, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Agent Kevin B. Jackson
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/40 ; H01L29/66 ; H01L29/78 ; H01L29/06 ; H01L29/417 ; H01L29/45 ; H01L29/49
Abstract:
A shielding structure for a semiconductor device includes a plurality of trenches. The trenches include passivation liners and shield electrodes, which are formed therein. In one embodiment, the shielding structure is placed beneath a control pad. In another embodiment, the shielding structure is placed beneath a control runner.
Public/Granted literature
- US20140197483A1 TRENCH SHIELDING STRUCTURE FOR SEMICONDUCTOR DEVICE AND METHOD Public/Granted day:2014-07-17
Information query
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