Invention Grant
- Patent Title: Semiconductor light-emitting element and manufacturing method thereof
- Patent Title (中): 半导体发光元件及其制造方法
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Application No.: US14077049Application Date: 2013-11-11
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Publication No.: US09306119B2Publication Date: 2016-04-05
- Inventor: Takayoshi Yamane
- Applicant: STANLEY ELECTRIC CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: STANLEY ELECTRIC CO., LTD.
- Current Assignee: STANLEY ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz & Volek PC
- Priority: JP2012-253412 20121119
- Main IPC: H01L33/22
- IPC: H01L33/22 ; H01L33/32 ; H01L33/00 ; H01L33/02

Abstract:
Provided is a semiconductor light-emitting element in which dopant interdiffusion is suppressed, the efficiency at which a carrier is infused into an active layer is improved, and there is less of a decrease in light-emitting intensity (droop) during high-current driving at a high light-emitting efficiency. The semiconductor light-emitting element composed of a GaN-based semiconductor includes an n-type semiconductor layer, an active layer formed on the n-type semiconductor layer, a first semiconductor layer formed on the active layer and having a concave/convex structure layer in the surface, and a second semiconductor structure layer doped with Mg and formed on the first semiconductor layer.
Public/Granted literature
- US20140138726A1 SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-05-22
Information query
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