Invention Grant
- Patent Title: Mold release film and method of process for producing a semiconductor device using the same
- Patent Title (中): 脱模膜及使用其的半导体装置的制造方法
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Application No.: US14445663Application Date: 2014-07-29
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Publication No.: US09306135B2Publication Date: 2016-04-05
- Inventor: Wataru Kasai , Yoshiaki Higuchi , Masakazu Ataku , Daisuke Taguchi , Satoshi Otsugu
- Applicant: ASAHI GLASS COMPANY, LIMITED
- Applicant Address: JP Chiyoda-ku
- Assignee: Asahi Glass Company, Limited
- Current Assignee: Asahi Glass Company, Limited
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2012-016476 20120130
- Main IPC: H01L33/56
- IPC: H01L33/56 ; B29C33/68 ; B29C43/18 ; C08J5/18 ; C08F10/06 ; H01L21/56 ; B29C43/02 ; B29C33/56 ; H01L23/00 ; B29C37/00 ; B29C43/50 ; C08F214/26 ; H01L33/58 ; B29C45/14 ; B29C43/34 ; B29L11/00 ; B29K83/00 ; B29L31/34
Abstract:
A mold release film, which is adapted to be disposed on the cavity surface of a mold to form a resin-encapsulated portion by encapsulating a semiconductor element of a semiconductor device with a curable encapsulation resin, has a tensile modulus of elasticity of from 10 to 24 MPa at 132° C. as measured in accordance with JIS K 7127, and a peak peel resistance of at most 0.8 N/25 mm.
Public/Granted literature
- US20140335634A1 MOLD RELEASE FILM AND METHOD OF PROCESS FOR PRODUCING A SEMICONDUCTOR DEVICE USING THE SAME Public/Granted day:2014-11-13
Information query
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