Invention Grant
US09306161B1 Fabrication methods of conducting bridge random access memory (CBRAM) device structures
有权
桥接随机存取存储器(CBRAM)器件结构的制造方法
- Patent Title: Fabrication methods of conducting bridge random access memory (CBRAM) device structures
- Patent Title (中): 桥接随机存取存储器(CBRAM)器件结构的制造方法
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Application No.: US13845922Application Date: 2013-03-18
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Publication No.: US09306161B1Publication Date: 2016-04-05
- Inventor: Yi Ma , Chakravarthy Gopalan , Antonio R. Gallo , Janet Wang
- Applicant: Adesto Technologies Corporation
- Applicant Address: US CA Sunnyvale
- Assignee: Adesto Technologies Corporation
- Current Assignee: Adesto Technologies Corporation
- Current Assignee Address: US CA Sunnyvale
- Main IPC: H01L21/321
- IPC: H01L21/321 ; H01L21/283 ; H01L45/00

Abstract:
A method of forming a conductive bridging memory cell can include forming an active electrode layer above a barrier layer formed on a lower conductive layer; forming at least one ion conductor layer over an active electrode layer; incorporating conductive ions into the ion conductor layer to create a switch memory layer that changes impedance in response to an electric field; and the active electrode layer is a source of conductive ions for the ion conductor, and the barrier layer substantially prevents a movement of conductive ions therethrough.
Information query
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