Invention Grant
- Patent Title: Wire-to-board connector
- Patent Title (中): 线对板连接器
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Application No.: US14384242Application Date: 2013-01-30
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Publication No.: US09306301B2Publication Date: 2016-04-05
- Inventor: Kenichi Shimoji
- Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LTD.
- Applicant Address: JP Tokyo
- Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LTD.
- Current Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Maier & Maier, PLLC
- Priority: JP2012-074033 20120328
- International Application: PCT/JP2013/000510 WO 20130130
- International Announcement: WO2013/145521 WO 20131003
- Main IPC: H01R12/70
- IPC: H01R12/70 ; H01R12/53 ; H01R12/57 ; H01R12/71 ; H01R12/75 ; H01R13/20 ; H01R101/00

Abstract:
A wire-to-board connector includes a plug which is attached to a wire, and a receptacle which is mounted on a connector mounting surface of a board. The plug and the receptacle are each formed of metal, and the plug is mated with the receptacle to thereby connect the wire to the board. The wire-to-board connector has the following structure. A wire direction corresponding to a longitudinal direction of the wire in the vicinity of the plug when the plug is mated with the receptacle is parallel to the connector mounting surface of the board. A mating direction in which the plug is mated with the receptacle is a direction approaching the connector mounting surface of the board.
Public/Granted literature
- US20150050820A1 WIRE-TO-BOARD CONNECTOR Public/Granted day:2015-02-19
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