Invention Grant
- Patent Title: Connection method between braided shield layer of shiled wire and drain wire, and connection structure of the same
- Patent Title (中): 编织屏蔽层与排线之间的连接方法及其连接结构
-
Application No.: US14241535Application Date: 2012-08-29
-
Publication No.: US09306355B2Publication Date: 2016-04-05
- Inventor: Hisashi Hanazaki
- Applicant: Hisashi Hanazaki
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Agent James E. Armstrong, IV; Brian S. Matross
- Priority: JP2011-188799 20110831
- International Application: PCT/JP2012/005429 WO 20120829
- International Announcement: WO2013/031204 WO 20130307
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H01R43/048 ; H01R4/20 ; H01R4/66 ; H01R9/05 ; H01B5/12

Abstract:
[Technical Problem]To provide a connection method between a braided shield layer of a shield wire and a drain wire, and a connection structure of the same enabling an easy and reliable connection, using no skilled operation such as soldering, and without an increase of non-shield area which is a problem when the braided shield layer is pulled out and a ground terminal is directly crimped onto the braided shield layer.[Solution to Problem]A connection method between a braided shield layer of a shield wire and a drain wire sequentially including the steps of a shield terminal insertion step; a shield layer folding and overlapping step; a drain wire overlapping step; a shield ring inserting step; and a crimping step.
Public/Granted literature
Information query