Invention Grant
- Patent Title: Method for manufacture of multi-layer wire structure for high efficiency wireless communication
- Patent Title (中): 用于高效无线通信的多层线结构的制造方法
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Application No.: US14059044Application Date: 2013-10-21
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Publication No.: US09306358B2Publication Date: 2016-04-05
- Inventor: Vinit Singh , Christine A. Frysz , Matthew Geary , Eitan Babcock , Justin Derbas
- Applicant: NUCURRENT, INC.
- Applicant Address: US IL Chicago
- Assignee: NuCurrent, Inc.
- Current Assignee: NuCurrent, Inc.
- Current Assignee Address: US IL Chicago
- Agency: McDermott Will & Emery LLP
- Main IPC: H01R43/20
- IPC: H01R43/20 ; H01Q7/00 ; A61N1/372
Abstract:
A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.
Public/Granted literature
- US20140041218A1 METHOD FOR MANUFACTURE OF MULTI-LAYER WIRE STRUCTURE FOR HIGH EFFICIENCY WIRELESS COMMUNICATION Public/Granted day:2014-02-13
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