Invention Grant
- Patent Title: Circuit board and image forming apparatus
- Patent Title (中): 电路板和成像设备
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Application No.: US13895277Application Date: 2013-05-15
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Publication No.: US09307634B2Publication Date: 2016-04-05
- Inventor: Norikazu Sugiyama , Takahiro Yoneyama , Fumiyuki Yamatsuka , Osamu Mukataka , Kumiko Omori
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: CANON KABUSHIKI KAISHA
- Current Assignee: CANON KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2012-124689 20120531; JP2013-098582 20130508
- Main IPC: H05K3/28
- IPC: H05K3/28 ; H05K1/02 ; G03G15/00 ; H05K3/40
Abstract:
The circuit board includes a contact for supplying power, in which the contact includes plural copper foil patterns each having a predetermined width, the plural copper foil patterns being formed radially from a center of the contact and connected to each other at the center of the contact. Accordingly, it is possible to enhance contact reliability of the contact while suppressing cost for connecting a high-voltage board to an image forming unit.
Public/Granted literature
- US20130322913A1 CIRCUIT BOARD AND IMAGE FORMING APPARATUS Public/Granted day:2013-12-05
Information query
