Invention Grant
US09307643B2 Substrate with built-in electronic component and method for manufacturing substrate with built-in electronic component
有权
具有内置电子部件的基板和用于制造具有内置电子部件的基板的方法
- Patent Title: Substrate with built-in electronic component and method for manufacturing substrate with built-in electronic component
- Patent Title (中): 具有内置电子部件的基板和用于制造具有内置电子部件的基板的方法
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Application No.: US14565763Application Date: 2014-12-10
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Publication No.: US09307643B2Publication Date: 2016-04-05
- Inventor: Hisayuki Nakagome , Toshiki Furutani
- Applicant: IBIDEN CO., LTD.
- Applicant Address: JP Ogaki-shi
- Assignee: IBIDEN CO., LTD.
- Current Assignee: IBIDEN CO., LTD.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2013-255047 20131210
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K3/42 ; H01G4/30 ; H05K3/46 ; H05K1/18 ; H05K3/40 ; H01G4/33 ; H01G4/40 ; H01G4/232 ; H01L23/13 ; H01L23/48 ; H01G4/12 ; C23C18/00
Abstract:
A substrate having a built-in electronic component includes an insulating substrate having an opening portion, a conductor pattern formed on the substrate, an electronic component accommodated in the opening portion of the substrate and having a terminal, an insulating layer formed on the substrate such that the insulating layer is covering the pattern and the component in the substrate, and multiple via conductors penetrating through the insulating layer and including a first via conductor reaching to the pattern on the substrate and a second via conductor reaching to the terminal of the component in the substrate. The pattern has a recessed connecting portion connected to the first via conductor, the terminal of the component has a recessed connecting portion connected to the second via conductor, and the recessed connecting portion of the pattern has depth which is greater than depth of the recessed connecting portion of the terminal.
Public/Granted literature
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