Invention Grant
- Patent Title: Power converter including semiconductor module and cooler
- Patent Title (中): 功率转换器包括半导体模块和冷却器
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Application No.: US14066022Application Date: 2013-10-29
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Publication No.: US09307681B2Publication Date: 2016-04-05
- Inventor: Shintarou Kogure , Hiroshi Inamura
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Nixon & Vanderhye P.C.
- Priority: JP2012-238036 20121029
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/473 ; H01L23/40 ; F16L41/08

Abstract:
A power converter including a semiconductor module; a cooler having a pair of coolant pipes; a casing provided with a pair of openings, housing the semiconductor module and the cooler; and a pair of grommets being fitted to the pair of openings where the pair of coolant pipes are inserted into the pair of grommets. Each of the grommet includes: a grommet body having a through hole through which a corresponding coolant pipe is inserted and a sealing surface that intimately contacts an inner peripheral surface of a corresponding opening; and a guide provided to one end of the grommet body, with respect to a direction of inserting the coolant pipe, so as to be projected outward further than the sealing surface. Each of the grommet is embedded with a reinforcement member with at least a part of the reinforcement member being located in the guide.
Public/Granted literature
- US20140118933A1 POWER CONVERTER INCLUDING SEMICONDUCTOR MODULE AND COOLER Public/Granted day:2014-05-01
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