Invention Grant
- Patent Title: Method and assembly including a connection between metal layers and a fusible material
- Patent Title (中): 方法和组件包括金属层和易熔材料之间的连接
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Application No.: US14157887Application Date: 2014-01-17
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Publication No.: US09308596B2Publication Date: 2016-04-12
- Inventor: Nagesh Basavanhally
- Applicant: ALCATEL-LUCENT USA INC.
- Applicant Address: FR Boulogne-Billancourt
- Assignee: Alcatel Lucent
- Current Assignee: Alcatel Lucent
- Current Assignee Address: FR Boulogne-Billancourt
- Agency: Carlson, Gaskey & Olds, P.C.
- Main IPC: G02B6/12
- IPC: G02B6/12 ; B23K1/20 ; B32B3/26 ; B23K1/00 ; B23K3/06 ; G02B6/42
Abstract:
An illustrative assembly includes a first component having a hole between two first component surfaces. The hole includes a first metal layer on the first component inside the hole. A second component includes a second component surfaced adjacent one of the first component surfaces. The second component includes a second metal layer on the second component. A fusible material is at least partially in the hole and at least partially in the recess. The metal alloy establishes a connection between the first and second metal layers.
Public/Granted literature
- US20150205046A1 METHOD AND ASSEMBLY INCLUDING A CONNECTION BETWEEN METAL LAYERS AND A FUSIBLE MATERIAL Public/Granted day:2015-07-23
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