Invention Grant
- Patent Title: Permeated grooving in CMP polishing pads
- Patent Title (中): CMP抛光垫中的渗透槽
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Application No.: US14029863Application Date: 2013-09-18
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Publication No.: US09308620B2Publication Date: 2016-04-12
- Inventor: Christopher Lee Schutte , Prakash Lakshmikanthan
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Jacqueline J. Garner; Frank D. Cimino
- Main IPC: B24B37/26
- IPC: B24B37/26 ; B24B37/24
Abstract:
A polishing pad for polishing a semiconductor wafer or other materials, having grooves in the polishing pad to enhance the usable lifetime of the polishing pad.
Public/Granted literature
- US20150079886A1 PERMEATED GROOVING IN CMP POLISHING PADS Public/Granted day:2015-03-19
Information query
