Invention Grant
- Patent Title: Composition for injection molding, sintered compact, and method for producing sintered compact
- Patent Title (中): 注射成型用组合物，烧结体和烧结体的制造方法
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Application No.: US13687243Application Date: 2012-11-28
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Publication No.: US09309383B2Publication Date: 2016-04-12
- Inventor: Nobuyuki Hamakura , Hidefumi Nakamura
- Applicant: Seiko Epson Corporation
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2011-262957 20111130
- Main IPC: C09B67/00
- IPC: C09B67/00 ; C22C29/00 ; C08K13/02 ; B22F3/12 ; C08L59/04 ; B22F1/00 ; B22F3/22 ; C08L23/06 ; C08L23/08
Abstract:
A composition for injection molding includes: an inorganic powder composed of at least one of a metal material and a ceramic material; and a binder containing a polyacetal-based resin, an unsaturated glycidyl group-containing polymer, and a lubricant. In the composition, the unsaturated glycidyl group-containing polymer is contained in an amount of 1% by mass or more and 30% by mass or less with respect to the amount of the polyacetal-based resin.
Public/Granted literature
- US20130133481A1 COMPOSITION FOR INJECTION MOLDING, SINTERED COMPACT, AND METHOD FOR PRODUCING SINTERED COMPACT Public/Granted day:2013-05-30
Information query
