Invention Grant
US09309446B2 Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device
有权
光敏粘合剂组合物，薄膜状粘合剂，粘合片，粘合剂图案，具有粘合剂层的半导体晶片，半导体器件
- Patent Title: Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device
- Patent Title (中): 光敏粘合剂组合物，薄膜状粘合剂，粘合片，粘合剂图案，具有粘合剂层的半导体晶片，半导体器件
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Application No.: US13410702Application Date: 2012-03-02
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Publication No.: US09309446B2Publication Date: 2016-04-12
- Inventor: Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi
- Applicant: Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi
- Applicant Address: JP Tokyo
- Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin and Flannery LLP
- Priority: JPP2009-250667 20091030; JPP2010-244033 20101029
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G03F7/004 ; C09J7/02 ; H01L23/00 ; G03F7/027 ; G03F7/037 ; G03F7/038 ; C08G73/10 ; C09J179/08 ; H01L21/683 ; H01L25/065 ; H01L23/29 ; H01L23/31
Abstract:
The present invention relates to a photosensitive adhesive composition that has thermal press bondability to an adherent after being patterned by exposure and development and enables alkali development, wherein a storage elastic modulus at 110° C. after exposure and further heat curing is not less than 10 MPa.
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