Invention Grant
- Patent Title: Electrocaloric effect heat transfer device dimensional stress control
- Patent Title (中): 电磁效应传热装置尺寸应力控制
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Application No.: US14259663Application Date: 2014-04-23
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Publication No.: US09310109B2Publication Date: 2016-04-12
- Inventor: Ezekiel Kruglick
- Applicant: Empire Technology Development LLC
- Applicant Address: US DE Wilmington
- Assignee: EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Current Assignee: EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Current Assignee Address: US DE Wilmington
- Agency: Maschoff Brennan
- Main IPC: F25B21/00
- IPC: F25B21/00

Abstract:
Technologies are generally described herein for electrocaloric effect heat transfer devices and methods effective to facilitate thermal energy transfer while mitigating mechanical stresses caused by expansion or contraction of electrocaloric effect material layers during thermal energy transfer operations. Some example heat transfer devices may include heat transfer stacks with at least two electrocaloric effect materials. Expanding electrocaloric effect material and contracting electrocaloric effect material are utilized to cancel the aggregate longitudinal dimensional change during application of an electric field. Some example heat transfer devices may utilize segmented electrocaloric effect material layers with stress relief gaps separating segments to mitigate delamination stress caused by lateral expansion or contraction of the electrocaloric effect material.
Public/Granted literature
- US20140230453A1 Electrocaloric Effect Heat Transfer Device Dimensional Stress Control Public/Granted day:2014-08-21
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