Invention Grant
- Patent Title: On-going reliability monitoring of integrated circuit chips in the field
- Patent Title (中): 现场集成电路芯片的可靠性监控
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Application No.: US13626040Application Date: 2012-09-25
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Publication No.: US09310426B2Publication Date: 2016-04-12
- Inventor: Theodoros E. Anemikos , Douglas S. Dewey , Pascal A. Nsame , Anthony D. Polson
- Applicant: International Business Machines Corporation
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Gibb & Riley, LLC
- Agent David A. Cain, Esq.
- Main IPC: G06G7/54
- IPC: G06G7/54 ; G01R31/28 ; G01R31/30 ; G11C29/06 ; G11C29/12 ; G11C11/412 ; G11C29/04

Abstract:
Disclosed is an integrated circuit (IC) chip with a built-in self-test (BIST) architecture that allows for in the field accelerated stress testing. The IC chip can comprise an embedded processor, which selectively alternates operation of an on-chip test block between a stress mode and a test mode whenever the IC chip is powered-on such that, during the stress mode, the test block operates at a higher voltage level than an on-chip functional block and such that, during the test mode, the test block operates at a same voltage level as the functional block and is subjected to testing. Also disclosed are a system, method and computer program product which access the results of such testing from IC chips in a variety of different types of products in order model IC chip performance degradation and to generate IC chip end of life predictions specific to the different types of products.
Public/Granted literature
- US20140088947A1 ON-GOING RELIABILITY MONITORING OF INTEGRATED CIRCUIT CHIPS IN THE FIELD Public/Granted day:2014-03-27
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