Invention Grant
US09310427B2 High speed tester communication interface between test slice and trays
有权
测试片和托盘之间的高速测试仪通讯接口
- Patent Title: High speed tester communication interface between test slice and trays
- Patent Title (中): 测试片和托盘之间的高速测试仪通讯接口
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Application No.: US13950164Application Date: 2013-07-24
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Publication No.: US09310427B2Publication Date: 2016-04-12
- Inventor: Eric Kushnick , Mei-Mei Su , Roland Wolff
- Applicant: Advantest Corporation
- Applicant Address: JP Tokyo
- Assignee: ADVANTEST CORPORATION
- Current Assignee: ADVANTEST CORPORATION
- Current Assignee Address: JP Tokyo
- Main IPC: G01R31/28
- IPC: G01R31/28 ; G06F11/22 ; G11C29/56

Abstract:
A tester system is disclosed. The tester system comprises a tester module operable to generate test signals for testing a plurality of DUTs. It also comprises a plurality of cables operable to communicatively couple the tester module with a tray comprising the plurality of DUTs through a thermal chamber wall interface. Further, it comprises a plurality of connectors in contact with the tray, wherein the plurality of connectors is operable to provide an interface between the plurality of cables and conductive traces on the tray, and further wherein each of the plurality of connectors is operable to pass a respective subset of the test signals to each DUT on the tray via the conductive traces.
Public/Granted literature
- US20150028908A1 HIGH SPEED TESTER COMMUNICATION INTERFACE BETWEEN TEST SLICE AND TRAYS Public/Granted day:2015-01-29
Information query