Invention Grant
- Patent Title: Lithography method and apparatus
- Patent Title (中): 平版印刷方法和仪器
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Application No.: US13810384Application Date: 2011-07-18
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Publication No.: US09310700B2Publication Date: 2016-04-12
- Inventor: Adrianus Hendrik Koevoets , Michael Jozef Mathijs Renkens , Sander Frederik Wuister
- Applicant: Adrianus Hendrik Koevoets , Michael Jozef Mathijs Renkens , Sander Frederik Wuister
- Applicant Address: NL Veldhoven
- Assignee: ASML Netherlands B.V.
- Current Assignee: ASML Netherlands B.V.
- Current Assignee Address: NL Veldhoven
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- International Application: PCT/EP2011/062255 WO 20110718
- International Announcement: WO2012/019874 WO 20120216
- Main IPC: G03B27/52
- IPC: G03B27/52 ; G03B27/32 ; G03B27/02 ; G03F7/20 ; B82Y10/00 ; B82Y40/00 ; G03F7/00
Abstract:
In an embodiment, a lithography method is disclosed that includes providing a providing a first heat load to a first area of an object, and providing a second heat load to a second area of the object, wherein the second heat load is configured to ensure a deformation of the first area of the object caused by providing both the first heat load and the second heat load is smaller than a deformation of the first area of the object caused by providing only the first heat load.
Public/Granted literature
- US20130128246A1 Lithography Method and Apparatus Public/Granted day:2013-05-23
Information query
