Invention Grant
- Patent Title: Substrate processing system, transfer module, substrate processing method, and method for manufacturing semiconductor element
- Patent Title (中): 基板处理系统，转印模块，基板处理方法以及半导体元件的制造方法
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Application No.: US13814358Application Date: 2011-08-03
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Publication No.: US09312153B2Publication Date: 2016-04-12
- Inventor: Tsutomu Hiroki
- Applicant: Tsutomu Hiroki
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: JP2010-178165 20100806
- International Application: PCT/JP2011/004401 WO 20110803
- International Announcement: WO2012/017653 WO 20120209
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677
Abstract:
A substrate processing system is provided with: a first transfer unit, which extends from a loader module to a first processing chamber for processing substrates, to transfer the substrates; and a second transfer unit, which is provided below or above the first transfer unit and extends from the loader module to a second processing chamber for processing substrates, to transfer the substrates. The first processing chamber and the second processing chamber do not overlap in the vertical direction, and are disposed at positions separated from each other in a plan view. At the same time, at least a part of the first transfer unit and at least a part of the second transfer unit overlap each other in the vertical direction.
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