Invention Grant
- Patent Title: Accommodating device for retaining wafers
- Patent Title (中): 用于保留晶片的容纳装置
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Application No.: US13994183Application Date: 2010-12-20
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Publication No.: US09312161B2Publication Date: 2016-04-12
- Inventor: Markus Wimplinger , Thomas Wagenleitner , Alexander Filbert
- Applicant: Markus Wimplinger , Thomas Wagenleitner , Alexander Filbert
- Applicant Address: AT
- Assignee: EV Group E. Thallner GmbH
- Current Assignee: EV Group E. Thallner GmbH
- Current Assignee Address: AT
- Agency: Kusner & Jaffe
- International Application: PCT/EP2010/007793 WO 20101220
- International Announcement: WO2012/083978 WO 20120628
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/683 ; H01L21/67 ; H01L21/66
Abstract:
A receiving means for receiving and mounting of wafers. The receiving means includes a mounting surface. A mounting means is provided for mounting a wafer on the mounting surface. A compensation means is provided for active, especially locally controllable, at least partial compensation of local and/or global distortions of the wafer.
Public/Granted literature
- US20130330165A1 ACCOMMODATING DEVICE FOR RETAINING WAFERS Public/Granted day:2013-12-12
Information query
IPC分类:
