Invention Grant
- Patent Title: Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics
- Patent Title (中): 具有中心触点和改善的热特性的增强堆叠微电子组件
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Application No.: US14605208Application Date: 2015-01-26
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Publication No.: US09312239B2Publication Date: 2016-04-12
- Inventor: Belgacem Haba , Wael Zohni , Richard Dewitt Crisp
- Applicant: Tessera, Inc.
- Applicant Address: US CA San Jose
- Assignee: Tessera, Inc.
- Current Assignee: Tessera, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K1/11 ; H05K1/14 ; H01L25/065 ; H01L23/13 ; H01L23/367 ; H01L23/433 ; H01L23/498 ; H01L23/00 ; H01L25/10 ; H01L23/373 ; H01L23/31
Abstract:
A microelectronic assembly includes a first unit and a second unit overlying the first unit. Each of the units include a dielectric element that includes first and second apertures, first and second microelectronic elements, first leads extending from contacts of the first microelectronic element through the first aperture, and second leads extending from contacts of the second microelectronic element through the second aperture. The microelectronic assembly further includes a heat spreader that is thermally coupled to at least one of the first microelectronic element or the second microelectronic element of the first unit. The heat spreader may be a monolithic structure having apertures substantially aligned with the contacts of the first and second microelectronic elements of the first unit.
Public/Granted literature
- US20150145117A1 ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS AND IMPROVED THERMAL CHARACTERISTICS Public/Granted day:2015-05-28
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