Invention Grant
- Patent Title: Semiconductor multi-project or multi-product wafer process
- Patent Title (中): 半导体多项目或多产品晶圆工艺
-
Application No.: US14824095Application Date: 2015-08-12
-
Publication No.: US09312254B2Publication Date: 2016-04-12
- Inventor: Weng-Dah Ken
- Applicant: Weng-Dah Ken
- Applicant Address: TW Hsinchu
- Assignee: Weng-Dah Ken
- Current Assignee: Weng-Dah Ken
- Current Assignee Address: TW Hsinchu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L25/00 ; H01L21/78 ; H01L21/768 ; H01L21/263 ; H01L21/283 ; H01L23/00 ; H01L23/544 ; H01L21/304 ; H01L21/66
Abstract:
The embodiment provides a semiconductor MP wafer process including processing a plurality of MP wafers in a lot or batch with a first process step. The plurality of the MP wafers is split into an MP wafer group-1 and an MP wafer group-2. At least one of the MP wafers of the MP wafer group-1 is processed with a second process step-1 and at least one of the MP wafers of the MP wafer group-2 is processed with a second process step-2 to form different device components on the MP wafers of the MP wafer group-1 and group-2, respectively. At least one of the MP wafers of the MP wafer group-1 is processed with a third process step-3 and at least one of the MP wafers of the MP wafer group-2 is processed with a third process step-4 to form a substantially same characteristic device component on the MP wafers.
Public/Granted literature
- US20160043065A1 SEMICONDUCTOR MULTI-PROJECT OR MULTI-PRODUCT WAFER PROCESS Public/Granted day:2016-02-11
Information query
IPC分类:
