Invention Grant
US09312304B2 LED illuminating device comprising light emitting device including LED chips on single substrate
有权
LED照明装置包括在单个基板上包括LED芯片的发光装置
- Patent Title: LED illuminating device comprising light emitting device including LED chips on single substrate
- Patent Title (中): LED照明装置包括在单个基板上包括LED芯片的发光装置
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Application No.: US14627239Application Date: 2015-02-20
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Publication No.: US09312304B2Publication Date: 2016-04-12
- Inventor: Shinya Ishizaki , Makoto Agatani , Tomokazu Nada , Toshio Hata
- Applicant: Sharp Kabushiki Kaisha
- Applicant Address: JP Osaka
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka
- Agency: Nixon & Vanderhye P.C.
- Priority: JP2010-012486 20100122
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L27/15 ; H01L33/48 ; H01L33/56 ; F21K99/00 ; F21V3/00 ; H01L25/075 ; H01L25/16 ; H01L33/54 ; H01L33/38 ; F21V29/74 ; F21V5/04 ; F21V23/00 ; H01L33/52 ; H01L33/60 ; H01L33/62 ; F21Y101/02 ; H01L33/50

Abstract:
A light emitting device includes: a ceramic substrate; a plurality of LED chips; a printed resistor(s) connected in parallel with the plurality of LED chips; a dam resin made of a resin having a low optical transmittance; a fluorescent-material-containing resin layer; and an anode-side electrode and a cathode-side electrode, (a) which are provided on a primary surface of the ceramic substrate so as to face each other along a first direction on the primary surface and (b) which are disposed below at least one of the dam resin and the fluorescent-material-containing resin layer. With the configuration in which a plurality of LEDs, which are connected in a series-parallel connection, are provided on a substrate, it is possible to provide a light emitting device which can achieve restraining of luminance unevenness and an improvement in luminous efficiency.
Public/Granted literature
- US20150171141A1 LIGHT EMITTING DEVICE Public/Granted day:2015-06-18
Information query
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