Invention Grant
- Patent Title: Semiconductor structure and fabrication method thereof
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Application No.: US14821815Application Date: 2015-08-10
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Publication No.: US09312359B2Publication Date: 2016-04-12
- Inventor: Ming-Te Wei , Shin-Chuan Huang , Yu-Hsiang Hung , Po-Chao Tsao , Chia-Jui Liang , Ming-Tsung Chen , Chia-Wen Liang
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/165

Abstract:
A semiconductor structure includes a gate structure disposed on a substrate and having an outer spacer, a recess disposed in the substrate and adjacent to the gate structure, a doped epitaxial material filling up the recess, a cap layer including an undoped epitaxial material and disposed on the doped epitaxial material, a lightly doped drain disposed below the cap layer and sandwiched between the doped epitaxial material and the cap layer, and a silicide disposed on the cap layer and covering the doped epitaxial material to cover the cap layer together with the outer spacer without directly contacting the lightly doped drain.
Public/Granted literature
- US20150349088A1 SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF Public/Granted day:2015-12-03
Information query
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