- Patent Title: Compound semiconductor device and manufacturing method of the same
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Application No.: US13740535Application Date: 2013-01-14
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Publication No.: US09312373B2Publication Date: 2016-04-12
- Inventor: Tadahiro Imada
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Kratz, Quintos & Hanson, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/872 ; H01L29/778 ; H01L27/06 ; H01L29/06 ; H01L29/20 ; H01L29/205

Abstract:
An electrode (109) insulated from a compound semiconductor layer (102) and being in contact with an electrode (101) and a compound semiconductor layer (103) is provided. A lattice constant of the compound semiconductor layer (103) is smaller than both of a lattice constant of the compound semiconductor layer (102) and a lattice constant of a compound semiconductor layer (104), and a lattice constant of a compound semiconductor layer (107) is smaller than both of the lattice constants of the compound semiconductor layer (102) and the lattice constants of the compound semiconductor layer (104). A conduction band energy of the compound semiconductor layer (103) is higher than a conduction band energy of the compound semiconductor layer (104).
Public/Granted literature
- US20130126897A1 COMPOUND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2013-05-23
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