Invention Grant
US09312455B2 Method for fabricating light emitting diode (LED) dice with wavelength conversion layers
有权
用波长转换层制造发光二极管（LED）晶片的方法
- Patent Title: Method for fabricating light emitting diode (LED) dice with wavelength conversion layers
- Patent Title (中): 用波长转换层制造发光二极管（LED）晶片的方法
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Application No.: US14541200Application Date: 2014-11-14
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Publication No.: US09312455B2Publication Date: 2016-04-12
- Inventor: Jui-Kang Yen , De-Shuo Chen
- Applicant: SemiLEDS Optoelectronics Co., Ltd., Chu-Nan Site
- Applicant Address: TW Chu-nan
- Assignee: SemiLEDS Optoelectronics Co., Ltd.
- Current Assignee: SemiLEDS Optoelectronics Co., Ltd.
- Current Assignee Address: TW Chu-nan
- Agent Stephen A. Gratton
- Main IPC: H01L33/50
- IPC: H01L33/50 ; H01L21/683
Abstract:
A method for fabricating light emitting diode (LED) dice includes the step of providing a wavelength conversion layer on a substrate on an adhesive layer configured to have reduced adhesiveness upon exposure to a physical energy, such as electromagnetic radiation or heat. The method also includes the step of exposing the adhesive layer on the substrate to the physical energy to reduce the adhesiveness of the adhesive layer, removing the wavelength conversion layer from the substrate, and attaching the wavelength conversion layer to the light emitting diode (LED) die.
Public/Granted literature
- US20150072455A1 METHOD FOR FABRICATING LIGHT EMITTING DIODE (LED) DICE WITH WAVELENGTH CONVERSION LAYERS Public/Granted day:2015-03-12
Information query
IPC分类:
