Invention Grant
- Patent Title: Load spreading interposer
- Patent Title (中): 负载扩展插值器
-
Application No.: US13765013Application Date: 2013-02-12
-
Publication No.: US09312607B2Publication Date: 2016-04-12
- Inventor: Steven R. Wolf
- Applicant: Raytheon Company
- Applicant Address: US MA Waltham
- Assignee: RAYTHEON COMPANY
- Current Assignee: RAYTHEON COMPANY
- Current Assignee Address: US MA Waltham
- Agency: Cantor Colburn LLP
- Main IPC: H05K5/02
- IPC: H05K5/02 ; H01Q21/00 ; H01R12/71 ; H05K7/10
Abstract:
A package for active electronics is provided. The package includes a housing structure configured to house the active electronics, a connector element and an interposer element disposed to define a tie point between the housing structure and the connector element such that the tie point is remote from respective edges of the housing structure and the connector element.
Public/Granted literature
- US20140226263A1 LOAD SPREADING INTERPOSER Public/Granted day:2014-08-14
Information query
