Invention Grant
- Patent Title: Implantable flexible circuit leads and methods of use
- Patent Title (中): 可植入的柔性电路引线及使用方法
-
Application No.: US11952062Application Date: 2007-12-06
-
Publication No.: US09314618B2Publication Date: 2016-04-19
- Inventor: Mir A. Imran , Albert G. Burdulis , Matthew D. Hills , Eyad Kishawi
- Applicant: Mir A. Imran , Albert G. Burdulis , Matthew D. Hills , Eyad Kishawi
- Applicant Address: US CA Menlo Park
- Assignee: Spinal Modulation, Inc.
- Current Assignee: Spinal Modulation, Inc.
- Current Assignee Address: US CA Menlo Park
- Main IPC: A61B5/04
- IPC: A61B5/04 ; A61N1/00 ; A61N1/05 ; H05K1/11

Abstract:
Devices, systems and methods are provided for stimulation of tissues and structures within a body of a patient. In particular, implantable leads are provided which are comprised of a flexible circuit. Typically, the flexible circuit includes an array of conductors bonded to a thin dielectric film. Example dielectric films include polyimide, polyvinylidene fluoride (PVDF) or other biocompatible materials to name a few. Such leads are particularly suitable for stimulation of the spinal anatomy, more particularly suitable for stimulation of specific nerve anatomies, such as the dorsal root (optionally including the dorsal root ganglion).
Public/Granted literature
- US20080140152A1 IMPLANTABLE FLEXIBLE CIRCUIT LEADS AND METHODS OF USE Public/Granted day:2008-06-12
Information query