Invention Grant
- Patent Title: Ingot cutting apparatus and ingot cutting method
- Patent Title (中): 锭切割装置和锭切割方法
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Application No.: US13121269Application Date: 2009-10-08
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Publication No.: US09314942B2Publication Date: 2016-04-19
- Inventor: Hidehiko Nishino , Yoshihiro Hirano , Shigeharu Tsunoda
- Applicant: Hidehiko Nishino , Yoshihiro Hirano , Shigeharu Tsunoda
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU HANDOTAI CO., LTD.
- Current Assignee: SHIN-ETSU HANDOTAI CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2008-286138 20081107
- International Application: PCT/JP2009/005236 WO 20091008
- International Announcement: WO2010/052827 WO 20100514
- Main IPC: B28D5/04
- IPC: B28D5/04 ; B28D5/00 ; B08B3/12 ; B08B7/02
Abstract:
An ingot cutting apparatus having at least one coolant pocket storing the coolant to be supplied to the blade, wherein the blade-abrasive-grain portion is brought into contact with the coolant stored in the at least one coolant pocket by causing the blade-abrasive-grain portion of the blade to travel through a groove portion provided at an upper portion of the at least one coolant pocket while driving to rotate the blade so that the coolant is supplied to the blade.
Public/Granted literature
- US20110174285A1 INGOT CUTTING APPARATUS AND INGOT CUTTING METHOD Public/Granted day:2011-07-21
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