Invention Grant
- Patent Title: Buffer assembly of vacuum molding and cutting machine
- Patent Title (中): 真空成型和切割机的缓冲装置
-
Application No.: US14040747Application Date: 2013-09-30
-
Publication No.: US09314958B2Publication Date: 2016-04-19
- Inventor: Chiou-Sheng Wei
- Applicant: CHENG MEI MACHINE CO., LTD.
- Applicant Address: TW Taoyuan County
- Assignee: CHENG MEI MACHINE CO., LTD.
- Current Assignee: CHENG MEI MACHINE CO., LTD.
- Current Assignee Address: TW Taoyuan County
- Agent Leong C. Lei
- Priority: TW101222758U 20121123
- Main IPC: B29C51/20
- IPC: B29C51/20 ; B29C51/26 ; B26F1/40 ; B30B15/00 ; B30B15/06 ; F16F15/023 ; B26D5/12 ; B29C51/38

Abstract:
Disclosed is a buffer assembly of a vacuum molding and cutting machine, and the buffer assembly includes a lower mold base, at least four hydraulic elements and a movable plate. The lower mold base has at least four installing holes for installing the hydraulic elements respectively, and each hydraulic element includes a piston plunger for propping the movable plate to a predetermined distance. When the cutting thickness is 0.1 mm-0.5 mm of a sheet, the impact force can be absorbed effectively to maintain the parallelism for the cutting, so as to improve the cutting quality and extend the service life of a die cutting tool.
Public/Granted literature
- US20140144738A1 BUFFER ASSEMBLY OF VACUUM MOLDING AND CUTTING MACHINE Public/Granted day:2014-05-29
Information query