Invention Grant
- Patent Title: Photocurable adhesive composition
- Patent Title (中): 可光固化粘合剂组合物
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Application No.: US14424715Application Date: 2013-09-04
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Publication No.: US09315699B2Publication Date: 2016-04-19
- Inventor: Sang Hwan Kim , Yong Hoon Lee , Dai Hyun Kim , Won Gu Choi , Jang Soon Kim
- Applicant: LG Hausys, Ltd.
- Applicant Address: KR Seoul
- Assignee: LG HAUSYS, LTD.
- Current Assignee: LG HAUSYS, LTD.
- Current Assignee Address: KR Seoul
- Agency: Hauptman Ham, LLP
- Priority: KR10-2012-0101328 20120913
- International Application: PCT/KR2013/007966 WO 20130904
- International Announcement: WO2014/042385 WO 20140320
- Main IPC: C08F2/46
- IPC: C08F2/46 ; C08F2/50 ; C08G61/04 ; C09J163/00 ; C09J163/04
Abstract:
Provided is an adhesive composition comprising: a thermosetting epoxy resin formed with an epoxy copolymer containing a hydroxyl group; and a UV curable epoxy resin having an epoxy equivalence of 100 g/eq to 500 g/eq.
Public/Granted literature
- US20150203726A1 PHOTOCURABLE ADHESIVE COMPOSITION Public/Granted day:2015-07-23
Information query
