Invention Grant
- Patent Title: Semiconductor package with package-on-package stacking capability and method of manufacturing the same
- Patent Title (中): 具有封装封装堆叠能力的半导体封装及其制造方法
-
Application No.: US14514360Application Date: 2014-10-14
-
Publication No.: US09318411B2Publication Date: 2016-04-19
- Inventor: Charles W. C. Lin , Chia-Chung Wang
- Applicant: BRIDGE SEMICONDUCTOR CORPORATION
- Applicant Address: TW Taipei
- Assignee: BRODGE SEMICONDUCTOR CORPORATION
- Current Assignee: BRODGE SEMICONDUCTOR CORPORATION
- Current Assignee Address: TW Taipei
- Agency: Pai Patent & Trademark Law Firm
- Agent Chao-Chang David Pai
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/36 ; H01L23/00 ; H01L25/10 ; H01L23/367 ; H01L23/538 ; H01L23/552 ; H01L25/065 ; H01L25/00 ; H01L23/498
Abstract:
The present invention relates to a method of making a semiconductor package with package-on-package stacking capability. In accordance with a preferred embodiment, the method is characterized by the step of attaching a chip-on-interposer subassembly on a metallic carrier with the chip inserted into a cavity of the metallic carrier, and the step of selectively removing portions of the metallic carrier to define a heat spreader for the chip. The heat spreader can provide thermal dissipation, electromagnetic shielding and moisture barrier, whereas the interposer provides a CTE-matched interface and fan-out routing for the chip.
Public/Granted literature
- US20150130046A1 SEMICONDUCTOR PACKAGE WITH PACKAGE-ON-PACKAGE STACKING CAPABILITY AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-05-14
Information query
IPC分类:
