Invention Grant
- Patent Title: Shielded system
- Patent Title (中): 屏蔽系统
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Application No.: US13665542Application Date: 2012-10-31
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Publication No.: US09318432B2Publication Date: 2016-04-19
- Inventor: Vlad Lenive , Terence Chi-Fung Kwok
- Applicant: Qualcomm Technologies International, Ltd.
- Applicant Address: GB Cambridge
- Assignee: Qualcomm Technologies International, Ltd.
- Current Assignee: Qualcomm Technologies International, Ltd.
- Current Assignee Address: GB Cambridge
- Agency: Mahamedi Paradice LLP
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H01L23/522 ; H01F17/00

Abstract:
A shielded system for reducing energy dissipation from an RF component into a semiconductor substrate, the shielded system comprising: a semiconductor substrate; an RF component in connection with the semiconductor substrate; an electrically connected shielding structure having a galvanic connection to ground or the semiconductor substrate, the electrically connected shielding structure being electrically connected to the RF component; and an electrically isolated shielding structure having no galvanic connection to ground, the semiconductor substrate or the RF component.
Public/Granted literature
- US20140118963A1 Shielded System Public/Granted day:2014-05-01
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