Invention Grant
- Patent Title: High voltage semiconductor device and method for fabricating the same
- Patent Title (中): 高压半导体器件及其制造方法
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Application No.: US13974558Application Date: 2013-08-23
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Publication No.: US09318586B2Publication Date: 2016-04-19
- Inventor: Nam Young Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2012-0105253 20120921
- Main IPC: H01L29/739
- IPC: H01L29/739 ; H01L27/082 ; H01L27/102 ; H01L29/06 ; H01L29/66 ; H01L29/423 ; H01L29/08

Abstract:
According to example embodiments of inventive concepts: a semiconductor device includes: first and second trench gates extending long in one direction in a substrate; third and fourth trench gates in the substrate, the third and fourth trench gates connecting the first and second trench gates with each other; a first region defined in the substrate by the first to fourth trench gates and surrounded by the first to fourth trench gates; and a second region and a third region defined in the substrate. The second region is in surface contact with the first region. The third region is in point contact with the first region. The first region includes a first high-voltage semiconductor device including a body of a first conduction type and an emitter of a second conduction type in the body. Floating wells of the first conduction type are in the second region and the third region.
Public/Granted literature
- US20140084332A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2014-03-27
Information query
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