Invention Grant
- Patent Title: FinFET device and method of fabricating same
- Patent Title (中): FinFET器件及其制造方法
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Application No.: US13902322Application Date: 2013-05-24
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Publication No.: US09318606B2Publication Date: 2016-04-19
- Inventor: Chih-Hao Wang , Kuo-Cheng Ching , Gwan Sin Chang , Zhiqiang Wu
- Applicant: Taiwan Semiconductor Manufacturing Company Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/78 ; H01L21/02 ; H01L29/66 ; H01L29/786

Abstract:
The present disclosure provides a semiconductor device. The semiconductor device includes a substrate having isolation regions, a gate region, source and drain regions separated by the gate region, a first fin structure in a gate region. The first fin structure includes a first semiconductor material layer as a lower portion of the first fin structure, a semiconductor oxide layer as an outer portion of a middle portion of the first fin structure, the first semiconductor material layer as a center portion of the middle portion of the first fin structure and a second semiconductor material layer as an upper portion of the first fin structure. The semiconductor device also includes a source/drain feature over the substrate in the source/drain region between two adjacent isolation regions and a high-k (HK)/metal gate (MG) stack in the gate region, wrapping over a portion of the first fin structure.
Public/Granted literature
- US20140197457A1 FinFET Device and Method of Fabricating Same Public/Granted day:2014-07-17
Information query
IPC分类: