Invention Grant
- Patent Title: Light emitting diode device and method for manufacturing same
- Patent Title (中): 发光二极管装置及其制造方法
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Application No.: US14085804Application Date: 2013-11-21
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Publication No.: US09318666B2Publication Date: 2016-04-19
- Inventor: Hsing-Fen Lo , Lung-Hsin Chen
- Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
- Applicant Address: TW Hsinchu Hsien
- Assignee: ADVANCED OPTOELECTRONICS TECHNOLOGY, INC.
- Current Assignee: ADVANCED OPTOELECTRONICS TECHNOLOGY, INC.
- Current Assignee Address: TW Hsinchu Hsien
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201310103017 20130328
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L27/15 ; H01L29/267 ; H01L31/12 ; H01L33/00 ; H01L33/48 ; H01L23/00 ; H01L33/54 ; H01L33/62

Abstract:
An LED device includes a substrate having a top surface and a bottom surface. The substrate defines a through hole at a center thereof. The LED device also includes an electrode board. The electrode board defines a concave portion at a center thereof, and a convex portion connected to and surrounding two sides of the concave portion. The concave portion includes a first electrode and a second electrode isolated from each other, and is located in the through hole of the substrate. A bottommost surface of the concave portion is substantially coplanar with the bottom surface of the substrate, and a top surface of the convex portion is substantially coplanar with the top surface of the substrate. An LED chip is arranged on the concave portion, and is electrically connected to the first electrode and the second electrode. A method for manufacturing plural such LED devices is also provided.
Public/Granted literature
- US20140291720A1 LIGHT EMITTING DIODE DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2014-10-02
Information query
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