Invention Grant
- Patent Title: Crimp terminal, connection structural body and method for producing the same
- Patent Title (中): 压接端子，连接结构体及其制造方法
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Application No.: US13914313Application Date: 2013-06-10
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Publication No.: US09318815B2Publication Date: 2016-04-19
- Inventor: Kengo Mitose , Naoya Takashima , Yukihiro Kawamura
- Applicant: FURUKAWA ELECTRIC CO., LTD. , FURUKAWA AUTOMOTIVE SYSTEMS INC.
- Applicant Address: JP Tokyo JP Shiga
- Assignee: FURUKAWA ELECTRIC CO., LTD.,FURUKAWA AUTOMOTIVE SYSTEMS INC.
- Current Assignee: FURUKAWA ELECTRIC CO., LTD.,FURUKAWA AUTOMOTIVE SYSTEMS INC.
- Current Assignee Address: JP Tokyo JP Shiga
- Agency: Osha Liang LLP
- Priority: JP2010-273141 20101208; JP2010-273142 20101208
- Main IPC: H01R4/18
- IPC: H01R4/18 ; H01R43/16 ; H01R43/048 ; H01R13/03 ; C25D11/04 ; C25D11/08 ; C25D11/24 ; C23C18/54 ; C25D11/02 ; H01R13/11
Abstract:
An insulating body-forming part is formed on a border between a surface of a crimp terminal formed of an aluminum material and a conductive contact body provided on the surface and containing a nobler metal material than the aluminum material.
Public/Granted literature
- US20130273787A1 CRIMP TERMINAL, CONNECTION STRUCTURAL BODY AND METHOD FOR PRODUCING THE SAME Public/Granted day:2013-10-17
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