Invention Grant
- Patent Title: Board to board electrical connector assembly
- Patent Title (中): 板对板电连接器组件
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Application No.: US14509122Application Date: 2014-10-08
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Publication No.: US09318823B2Publication Date: 2016-04-19
- Inventor: Kuo-Ching Lee , Ta-Teh Meng , Shuang-Lin Yuan , Mei Shi , Chiah-Siang Chang
- Applicant: Advanced-Connectek Inc.
- Applicant Address: TW New Taipei
- Assignee: Advanced-Connectek Inc.
- Current Assignee: Advanced-Connectek Inc.
- Current Assignee Address: TW New Taipei
- Agency: Kamrath IP Lawfirm, P.A.
- Agent Alan D. Kamrath
- Priority: CN201410032611 20140124
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R12/71 ; H01R12/70

Abstract:
The invention relates to an electrical connector assembly comprising a first connector and a second connector. The first connector comprises a first insulating body and first terminals. The first insulating body comprises an inserting wall. The first terminal comprises a U-shaped segment fixed to the inserting wall and a first soldering foot. Two outer surfaces of the U-shaped segment respectively comprise a coupling part. The second connector comprises a second insulating body and second terminals. The second insulating body comprises a receiving trough, separating plates, and separating troughs. The receiving trough matches the inserting wall. The separating plate comprises a first chamfer and a second chamfer. The second terminal comprises a pair of elastic arms, a main arm, and a second soldering foot. The pair of elastic arms is fixed in the receiving trough and matches the U-shaped segment. The main arm is disposed in the separating trough.
Public/Granted literature
- US20150214643A1 Electrical Connector Assembly Public/Granted day:2015-07-30
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