Invention Grant
- Patent Title: Microphone package with integrated substrate
- Patent Title (中): 带集成基板的麦克风包
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Application No.: US13971382Application Date: 2013-08-20
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Publication No.: US09319799B2Publication Date: 2016-04-19
- Inventor: Jay Salmon
- Applicant: Robert Bosch GmbH
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Michael Best & Friedrich LLP
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R9/08 ; H04R11/04 ; H04R17/02 ; H04R19/04 ; H04R21/02 ; H04R1/28 ; H04R19/00 ; B81C1/00 ; H04R1/00
Abstract:
MEMS microphone packages are described that include an ASIC integrated in the base substrate of the package housing. Methods of manufacturing the same and methods for separating individual microphone packages from wafer form assembly arrays are also described.
Public/Granted literature
- US20140264654A1 MICROPHONE PACKAGE WITH INTEGRATED SUBSTRATE Public/Granted day:2014-09-18
Information query
