A printed wiring board includes an interlayer resin insulation layer having a penetrating hole, a conductive circuit formed on a first surface of the interlayer resin insulation layer, a filled via conductor formed in the penetrating hole of the interlayer resin insulation layer and connected to the conductive circuit, a first surface-treatment coating structure formed on a first surface of the filled via conductor and having an electroless plating structure, and a second surface-treatment coating structure formed on a second surface of the filled via conductor on an opposite side with respect to the first surface-treatment coating structure and having an electroless plating structure. The filled via conductor includes a first conductive layer formed on side wall of the penetrating hole and a plated material filling the penetrating hole, and the first surface-treatment coating structure has a thickness which is different from a thickness of the second surface-treatment coating structure.