Invention Grant
US09320155B2 Ceramic substrate composite and method for manufacturing ceramic substrate composite
有权
陶瓷基板复合材料及陶瓷基板复合材料的制造方法
- Patent Title: Ceramic substrate composite and method for manufacturing ceramic substrate composite
- Patent Title (中): 陶瓷基板复合材料及陶瓷基板复合材料的制造方法
-
Application No.: US14128954Application Date: 2012-12-21
-
Publication No.: US09320155B2Publication Date: 2016-04-19
- Inventor: Taiji Kuroiwa , Seiichi Nakatani , Yoshihisa Yamashita , Susumu Sawada
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2012-103429 20120427
- International Application: PCT/JP2012/084255 WO 20121221
- International Announcement: WO2013/161133 WO 20131031
- Main IPC: H05K3/46
- IPC: H05K3/46 ; H05K1/03 ; H05K3/40 ; H05K3/22
Abstract:
A ceramic substrate composite includes a conductor pattern composite and an insulating layer on a ceramic substrate. The ceramic substrate composite is formed such that the conductor pattern composite and the insulating layer are provided on the ceramic substrate with each other so that the insulating layer overlaps a part of the conductor pattern composite. The conductor pattern composite is composed of a conductor portion and an insulating portion that exists locally in the conductor portion, and the insulating portion is an insulating material that constitutes the insulating layer.
Public/Granted literature
- US20140131076A1 CERAMIC SUBSTRATE COMPOSITE AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE COMPOSITE Public/Granted day:2014-05-15
Information query
