Invention Grant
- Patent Title: Cooling a secondary component by diverting airflow using an air channel associated with a thermal dissipation device that cools a primary component
- Patent Title (中): 使用与冷却主要部件的散热装置相关联的空气通道转向气流来冷却辅助部件
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Application No.: US14006033Application Date: 2011-06-27
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Publication No.: US09320159B2Publication Date: 2016-04-19
- Inventor: Kevin Leigh , Arlen L. Roesner
- Applicant: Kevin Leigh , Arlen L. Roesner
- Applicant Address: US TX Houston
- Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee Address: US TX Houston
- Agency: Hewlett Packard Enterprise Patent Department
- International Application: PCT/US2011/041954 WO 20110627
- International Announcement: WO2013/002751 WO 20130103
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K5/02 ; H01L23/467 ; H01L23/473
Abstract:
Heat is conducted from a primary component to a thermal dissipation structure. An airflow removes from the thermal dissipation structure. An air channel associated with the thermal dissipation structure diverts a portion of the airflow to a secondary component, thereby providing cooling to the secondary component.
Public/Granted literature
Information query
