Invention Grant
- Patent Title: Data center cooling system
- Patent Title (中): 数据中心冷却系统
-
Application No.: US14360194Application Date: 2011-11-22
-
Publication No.: US09320177B2Publication Date: 2016-04-19
- Inventor: Pierre Levesque
- Applicant: Pierre Levesque
- Applicant Address: CA Montreal
- Assignee: LE GROUPE S.M. INC.
- Current Assignee: LE GROUPE S.M. INC.
- Current Assignee Address: CA Montreal
- Agency: Dann, Dorfman, Herrell & Skillman
- Agent Kathleen D. Rigaut
- International Application: PCT/US2011/061870 WO 20111122
- International Announcement: WO2013/077858 WO 20130530
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/473

Abstract:
A data center has a room having a cold aisle and a hot aisle and a plurality of electronic components disposed between the cold and hot aisles. At least one air-to-liquid heat exchanger is disposed between the hot and cold aisles. At least one first fan circulates air in the room at a first flow rate. The at least one first fan circulates air through the at least one air-to-liquid heat exchanger from the hot aisle to the cold aisle. An air supply system is fluidly connected to the room. The air supply system includes an air filter, and a second fan supplying air from outside the room to the room at a second flow rate. The second flow rate is lower than the first flow rate. A data center cooling system and a data center having the data center cooling system are also disclosed.
Public/Granted literature
- US20150156926A1 Data Center Cooling System Public/Granted day:2015-06-04
Information query