Invention Grant
- Patent Title: Endovascular aneurysm repair system
- Patent Title (中): 血管内动脉瘤修复系统
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Application No.: US13162384Application Date: 2011-06-16
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Publication No.: US09320589B2Publication Date: 2016-04-26
- Inventor: Lee Bolduc
- Applicant: Lee Bolduc
- Applicant Address: US CA Santa Rosa
- Assignee: Medtronic Vascular, Inc.
- Current Assignee: Medtronic Vascular, Inc.
- Current Assignee Address: US CA Santa Rosa
- Main IPC: A61F2/06
- IPC: A61F2/06 ; A61B17/064 ; A61B17/068 ; A61F2/07 ; A61F2/848 ; A61F2/90

Abstract:
Method and apparatus for implanting radially expandable prostheses in the body lumens rely on tacking or anchoring of the prostheses with separately introduced fasteners. The prostheses may be self-expanding or balloon expandable. After initial placement, a fastener applier system is introduced within the expanded prostheses to deploy a plurality of fasteners at least one prosthesis end, usually as each end of the prosthesis. The fasteners are usually helical fasteners which are delivered from a helical track in the fastener applier by rotation with a rotator wire. The fasteners will be applied singly, typically in circumferentially spaced-apart patterns about the interior of each end of the prosthesis.
Public/Granted literature
- US20120065661A1 ENDOVASCULAR ANEURYSM REPAIR SYSTEM Public/Granted day:2012-03-15
Information query
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