Invention Grant
- Patent Title: Reduced wire profile stent
- Patent Title (中): 减少线型支架
-
Application No.: US13644255Application Date: 2012-10-03
-
Publication No.: US09320623B2Publication Date: 2016-04-26
- Inventor: Michael Ryan , James Michael Carlson
- Applicant: Cook Medical Technologies LLC
- Applicant Address: US IN Bloomington
- Assignee: Cook Medical Technologies LLC
- Current Assignee: Cook Medical Technologies LLC
- Current Assignee Address: US IN Bloomington
- Agency: Brinks Gilson & Lione
- Main IPC: A61F2/86
- IPC: A61F2/86 ; A61F2/90
Abstract:
Methods and apparatuses of stents with likely reduced rates of tissue perforation are provided. Some embodiments include reducing the profile of a portion of the stent using a wire profile reduction electropolishing bath and/or other wire profile reduction means.
Public/Granted literature
- US20130184833A1 REDUCED WIRE PROFILE STENT Public/Granted day:2013-07-18
Information query
IPC分类:
