Invention Grant
- Patent Title: Method for producing patch, patch and package
- Patent Title (中): 生产贴片,贴片和封装的方法
-
Application No.: US14317976Application Date: 2014-06-27
-
Publication No.: US09320728B2Publication Date: 2016-04-26
- Inventor: Takahito Yoshizaki , Kouji Tanaka , Kazunosuke Aida , Terumitsu Kaiho , Nobuo Tsutsumi
- Applicant: HISAMITSU PHARMACEUTICAL CO., INC.
- Applicant Address: JP Tosu-shi
- Assignee: HISAMITSU PHARMACEUTICAL CO., INC.
- Current Assignee: HISAMITSU PHARMACEUTICAL CO., INC.
- Current Assignee Address: JP Tosu-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2013-137147 20130628
- Main IPC: A61K31/4045
- IPC: A61K31/4045 ; A61K9/70

Abstract:
A method for producing a patch comprising a support layer and an adhesive agent layer arranged on at least one surface of the support layer, the method comprising: step A) obtaining an adhesive agent layer composition comprising free ropinirole in an amount which results in a content of 5 to 13.2% by mass in an obtained adhesive agent layer; step B) heating the adhesive agent layer composition at a temperature in a range from 50 to 76° C. for 5 minutes to 24 hours; and step C) cooling the heated adhesive agent layer composition to normal temperature at an average rate of temperature drop of 1 to 20° C./hour, thereby obtaining the adhesive agent layer comprising the free ropinirole at a supersaturated concentration in a dissolved form.
Public/Granted literature
- US20150004215A1 METHOD FOR PRODUCING PATCH, PATCH AND PACKAGE Public/Granted day:2015-01-01
Information query
IPC分类: