Invention Grant
- Patent Title: Apparatuses and methods for cutting porous substrates
- Patent Title (中): 用于切割多孔基材的设备和方法
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Application No.: US12826877Application Date: 2010-06-30
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Publication No.: US09321095B2Publication Date: 2016-04-26
- Inventor: Weston Blaine Griffin
- Applicant: Weston Blaine Griffin
- Applicant Address: US NY Niskayuna
- Assignee: GENERAL ELECTRIC COMPANY
- Current Assignee: GENERAL ELECTRIC COMPANY
- Current Assignee Address: US NY Niskayuna
- Agency: Fletcher Yoder, P.C.
- Main IPC: B21D45/08
- IPC: B21D45/08 ; B21D45/00 ; B26D7/02 ; B26F1/02 ; G01N1/28 ; B26F1/14

Abstract:
Apparatuses and methods for cutting a sample piece, having a shape and an outer dimension, out of a porous substrate, comprising: a puncher having an outermost dimension at a punch head; a stripping sleeve; a die having an innermost dimension that is larger than the outermost dimension of the punch head; and a fixture that holds the die in a fixed position relative to the puncher and stripping sleeve.
Public/Granted literature
- US20120000330A1 APPARATUSES AND METHODS FOR CUTTING POROUS SUBSTRATES Public/Granted day:2012-01-05
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