Invention Grant
US09321095B2 Apparatuses and methods for cutting porous substrates 有权
用于切割多孔基材的设备和方法

Apparatuses and methods for cutting porous substrates
Abstract:
Apparatuses and methods for cutting a sample piece, having a shape and an outer dimension, out of a porous substrate, comprising: a puncher having an outermost dimension at a punch head; a stripping sleeve; a die having an innermost dimension that is larger than the outermost dimension of the punch head; and a fixture that holds the die in a fixed position relative to the puncher and stripping sleeve.
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